Product Info

Bond 1-SF is a self-etch, one-coat bonding agent that is solvent-free — eliminating the need to air dry. Bond-1 SF is designed for direct composite restorations and dual cure materials. Bond-1 SF provides optimal bond strengths up to 30.4 MPa in just three basic steps: apply evenly, rub for 20 seconds, and light cure. Benefits: - Solvent-free: Protects against sensitivity, eliminating common technique-sensitive issues such as under- and over-drying; also prevents evaporation. - No air drying: Saves you precious chair time; doesn’t leave you guessing “how dry is too dry”. - Self-etch: No need to acid etch; saves time and protects against sensitivity. - Versatile: Can be used in conjunction with light cure and dual cure materials. - Unique handling properties: Enables an even spread of the material, ensuring complete coverage and optimal results. - One coat: Easy to use; reduces procedure time. Indications: - Direct composite restorations. - Bonding agent for repairs to composite, ceramic and metal substrates. - Pit and fissure sealant. - Compatible with dual cure materials, only when the initial layer is light initiated. Pack contains: - 1 x 2 ml syringe. - Flocked needle tips. - Instructions.